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AMP FROM TE CONNECTIVITY  8-215570-0  Wire-To-Board Connector, Micro-MaTch Series, IDC / IDT, Plug, 10 Contacts, 1.27 mm

AMP FROM TE CONNECTIVITY 8-215570-0
Technical Data Sheet (3.86MB) EN See all Technical Docs

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Product Overview

The 8-215570-0 is a 10-position vertical shrouded paddle-board Wire-to-Board Pin Header with tin over nickel-plated phosphor bronze contacts and red GF polyester housing. The Micro-MaTch series connector supports through-hole termination method to PC board and Insulation Displacement Crimp (IDC) termination method to wire/cable. The Micro-MaTch connector family, with its contact spacing of 1.27mm, offers a variety of wire-to-board interconnections. The Micro-MaTch contact helps prevent fretting corrosion, the traditional failure mode in tin-plated connections. Relative movements caused by vibrations/thermal expansion between male and female contacts are absorbed by an additional positioning spring in the female part. By preventing movements on the contact spot, a gas tight connection can make the Micro-MaTch contact spring system fretting corrosion resistant.
  • Kink PCB mount retention
  • Polarization mating alignment

Product Information

Product Range:
Micro-MaTch Series
No. of Contacts:
10Contacts
Gender:
Plug
Pitch Spacing:
1.27mm
Contact Termination Type:
IDC / IDT
No. of Rows:
2Rows
Contact Plating:
Tin Plated Contacts
Contact Material:
Phosphor Bronze
SVHC:
No SVHC (15-Jun-2015)

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Applications

  • Audio;
  • Wireless

Legislation and Environmental

Country of Origin:
France

Country in which last significant manufacturing process was carried out

RoHS Compliant:
Yes
Tariff No:
85369010
Weight (kg):
.000617

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