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BGA-PP-035 - 

Heat Sink, For Ball Grid Array, Push-Pin, 7 °C/W, BGA, 49 mm, 20 mm, 49 mm

BGA-PP-035 - Heat Sink, For Ball Grid Array, Push-Pin, 7 °C/W, BGA, 49 mm, 20 mm, 49 mm

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Product Overview

The BGA-PP-035 is a push-pin Heat Sink with thermal tape suitable for BGA packages. With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
  • Black anodised finish


HVAC, Thermal Management

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9 total stock globally

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7 available for 4 - 5 business days delivery
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More stock available week commencing 2/12/19

$2.51 ( $2.89 Inc. GST)

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