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BGA-STD-025 - 

Heat Sink, For Ball Grid Array, Standard, 22 °C/W, BGA, 23 mm, 6 mm, 23 mm

BGA-STD-025 - Heat Sink, For Ball Grid Array, Standard, 22 °C/W, BGA, 23 mm, 6 mm, 23 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer Part No:
BGA-STD-025
Order Code:
2084427
Technical Datasheet:
BGA-STD-025   Datasheet
See all Technical Docs

Product Information

:
22°C/W
:
BGA
:
23mm
:
6mm
:
23mm
:
-
:
Aluminium
:
0.906"
:
0.236"
:
0.906"
:
-
:
-
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Product Overview

The BGA-STD-025 is a 23 x 23 x 6mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array.

Applications

Industrial

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1,500 will be available for delivery on 20/08/19

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