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CCI02 - 

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

CCI02 - Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer:
CCI CCI
Manufacturer Part No:
CCI02
Order Code:
1373294
Technical Datasheet:
CCI02   Datasheet
See all Technical Docs

Product Information

:
7.93°C/W
:
BGA
:
45mm
:
10mm
:
45mm
:
-
:
Aluminium
:
1.77"
:
0.39"
:
1.77"
:
-
:
-
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Product Overview

The CCI02 is a Heat Sink made of aluminium typically used with DSP, FPGAs and other electronics BGA packages. It is also suitable for variety of applications requiring simple extension of surface area for cooling. The double sided adhesive provides simple and effective attachment.

Applications

HVAC, Thermal Management

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86 total stock globally

86 available for 4 - 5 business days delivery
 
Check Stock & Lead Times

100 will be available for delivery on 8/08/19

More stock available week commencing 26/08/19

$3.33 ( $3.83 Inc. GST)

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