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CCI09 - 

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.96 °C/W, BGA, 30 mm, 6 mm, 30 mm

CCI09 - Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.96 °C/W, BGA, 30 mm, 6 mm, 30 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer:
CCI CCI
Manufacturer Part No:
CCI09
Order Code:
1373296
Technical Datasheet:
CCI09   Datasheet
See all Technical Docs

Product Information

:
9.96°C/W
:
BGA
:
30mm
:
6mm
:
30mm
:
-
:
Aluminium
:
1.18"
:
0.24"
:
1.18"
:
-
:
-
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Product Overview

The CCI09 is a 9 x 30 x 30mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.

Applications

Industrial

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