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ICK BGA 23X23 - 

Heat Sink, For Ball Grid Array, 23 °C/W, BGA, PLCC, 23 mm, 6 mm, 23 mm

ICK BGA 23X23 - Heat Sink, For Ball Grid Array, 23 °C/W, BGA, PLCC, 23 mm, 6 mm, 23 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer Part No:
ICK BGA 23X23
Order Code:
1211702
Technical Datasheet:
ICK BGA 23X23   Datasheet
See all Technical Docs

Product Information

:
23°C/W
:
BGA, PLCC
:
23mm
:
6mm
:
23mm
:
-
:
Aluminium
:
0.91"
:
0.24"
:
0.91"
:
-
:
-
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Product Overview

The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
  • 1.8mm Plate thickness

Applications

Industrial

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816 total stock globally

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More stock available week commencing 12/08/19

$2.52 ( $2.90 Inc. GST)

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