Issue 38
KEEP PACE WITH
AN EVER CHANGING MARKET
Discover over 14,000 featured
products from leading manufacturers*
*All savings shown are against the price on the element14 website as of February 2022
*Terms & conditions apply
Welcome to the 38th edition of Connect magazine
Luke Grigg
Regional Sales Director
Australia & New Zealand
Keep pace with an ever changing market
Multicomp Pro tri rated cable and wire
Explore Multicomp Pro's tri-rated cable and wire range
Keeping you up to date
Tomorrow’s wireless technology today
Explore our online journal providing in-depth technical insight into new technologies, along with analysis and explanations from supplier partners, industry experts, and element14 engineers on key new trends shaping today's electronics industry.
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Demystifying AI and ML with embedded devices
Machine learning (ML) enables electronic systems to learn from existing data and use their own knowledge to measure, predict, and make decisions. Since these types of applications normally require high computational power, they always run on PCs and cloud servers. Thanks to innovative techniques, algorithms and robust workflows, machine learning can now be carried out directly on embedded devices.
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How to improve analog to digital converter accuracy
The accuracy of an ADC (Analog to Digital Converter) exhibits how close you are to represent the true signal in your measurement. It is determined by the DC specifications for gain, offset, and linearity and is affected by parameters associated with voltage source, I/O switching, PCB layout and analog source impedance.
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How to design multi-rail power supply unit using PMIC
A typical processing system in an electronic circuit has distinct multi DC power rails to support the core, MPU, analog units, external IO, DDR, eMMC, and the wireless network. A high-performance IC such as an FPGA can easily have half a dozen or more distinct DC power rails to support the device core, RAM, internal buffers, and external I/O such as I2C, SPI, LVDS, and other ports.
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Integration of 2D and 3D image sensing in IoT
How to utilise the pixel aperture approach to extract depth information from a CMOS image sensor and create normal 2D pictures, as well as pixel circuits and how to overcome the obstacles of a 3D image sensing system.
Read moreYour trusted partner in electronics
New products
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Electromechanical
Take a look at our vast range of electromechanical components from leading manufacturers.
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Interconnect
Find your perfect connection with our selection of cables, wire, connectors, accessories, assemblies and more.
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Multicomp Pro
Browse Multicomp Pro’s huge range of products and components, including test and tools, electronic components, connectors, cables and more.
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Passives
Shop our range of passive components including capacitors, filters, inductors, resistors and more.
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SBC & development kits
Meet your application needs with our latest range of Single Board Computers and Development Kits.
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Semiconductors
Explore our range of semiconductors including, Integrated circuits (IC), discretes, transistors and more.
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Test & measure
Explore our range of test and measurement equipment for your analysing requirements.
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Tools & production supplies
Check out our assortment of tools and production supplies to help you with your project or maintenance requirements.
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Terms & conditions
- All products shown in this issue of Connect (the ‘Publication’) are subject to availability and all sales of these products are subject to the element14 Standard Terms and Conditions of Sale as set out on the element14 website. To obtain a copy, call 1300 361 005 or visit nz.element14.com/terms-and-conditions.
- The Publication is valid from 4th April – 1st July 2022.
- All savings shown in the Publication are against the price on the element14 website (nz.element14.com) as of February 2022.
- Any further discount (special pricing, quote discounts, discount vouchers, etc.) is not applicable on Connect products.
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- Changes may be made to products by our suppliers.
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