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2317857-2 - 

Dust Cap / Cover, Dust & EMI Cover, AMP OSFP I/O Connectors, Zinc Alloy Body

2317857-2 - Dust Cap / Cover, Dust & EMI Cover, AMP OSFP I/O Connectors, Zinc Alloy Body

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Product Overview

TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps
  • Applications: Servers, Switches, Storage Devices, Routers etc.


Communications & Networking, Data / Computing, Industrial, Telecommunications

Product Information

Dust & EMI Cover
AMP OSFP I/O Connectors
Zinc Alloy Body
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837 total stock globally

837 available for 4 - 5 business days delivery
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More stock available week commencing 13/01/20

$10.15 ( $11.67  Inc. GST)

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