BGA-STD-065
Heat Sink, For Ball Grid Array, Standard, 12.2 °C/W, BGA, 27.8 mm, 11.2 mm, 27.8 mm
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $4.330 ($4.9795) |
| 10+ | $3.780 ($4.347) |
| 25+ | $3.720 ($4.278) |
| 50+ | $3.640 ($4.186) |
| 100+ | $3.560 ($4.094) |
Product Information
Product Overview
The BGA-STD-065 is a standard Heat Sink with thermal tape suitable for BGA packages. With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- Black anodised finish
Applications
HVAC, Thermal Management
Technical Specifications
12.2°C/W
27.8mm
27.8mm
Aluminium
0.441"
-
BGA
11.2mm
-
1.09"
1.09"
-
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Great Britain
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate