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Quantity | Price (Incl GST) |
---|---|
1+ | $916.520 ($1,053.998) |
10+ | $809.730 ($931.1895) |
Product Information
Product Overview
AD-FXTOF1-EBZ 3D ToF development kit is a depth sensing solution, ideal for developing 3D computer vision systems. It uses a VGA CCD that enables the capture of a 640×480 depth map of a scene at 30 frames per second, providing up to 4× higher resolution than many other TOF systems on the market. This enables the detection and measurement of distances to smaller and thinner objects that would otherwise be invisible to other ToF systems. The AD-FXTOF1-EBZ is a proven hardware platform for depth perception. When paired with a processor board from the Raspberry Pi or Nvidia family, it can be used for 3D software and algorithm development. The solution has VGA resolution which means that objects can be detected to a higher level of granularity than other 3D ToF solutions, an ability to detect depth in strong ambient light conditions and multiple range detection modes for increased accuracy. A native and host SDK is provided.
- Output: depth & IR images at 640 × 480 pixels (VGA), 30fps
- Distance sensing range up to 3m
- Measurement accuracy of typical <lt/> 2% of the measured distance
- Connectivity: 2 lanes MIPI CSI-2, 25 pin flex cable or 15 pin flex cable via an interposer board
- Supply voltage of 5V at 2000mA, frame rate of 30fps
- Optics: 940nm VCSEL, FOV: 87°x67°, AR coated lens with 940 BPF, FoV: 87°×67°
- Operating temperature range from -20°C to 75°C, resolution 640 x 480 pixels
- Tested for shock and vibe, temperature and humidity, drop
- Certified eye safe in accordance with IEC 60825-1:2014 & 2007
- Compatible with Analog Devices open source 3D ToF SDK
Contents
ToF module, Interposer board, 25 pins flex cable, 15 pins flex cable, Screws and standoffs to attach the interposer board to the ToF module, USB cable to supply 5V to the system.
Notes
ADI products are only authorized (and sold) for use by the customer and are not to be resold or otherwise passed on to any third party
Technical Specifications
Development Kit
3D Time-of-Flight Sensor
No SVHC (07-Jul-2017)
ADDI9036
ToF Module, Interposer Board, 25 / 15 Pin Flex Cable, Screws and Standoffs, USB Cable
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Philippines
Country in which last significant manufacturing process was carried out
Product Compliance Certificate