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ICK BGA 27 X 27 X 10
Heat Sink, Square, PCB, For Ball Grid Arrays, 18.5 °C/W, BGA, 27 mm, 10 mm, 27 mm
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ManufacturerFISCHER ELEKTRONIK
Manufacturer Part NoICK BGA 27 X 27 X 10
Order Code185004302
Your Part Number
Technical Datasheet
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $3.230 ($3.7145) |
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Product Information
ManufacturerFISCHER ELEKTRONIK
Manufacturer Part NoICK BGA 27 X 27 X 10
Order Code185004302
Technical Datasheet
Product Overview
The ICK BGA 27 X 27 X 10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
- Universal socket
- 3.3W Dissipation loss (Pv)
Applications
HVAC, Thermal Management
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Tariff No:76169990
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.0038