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FEMC512GBE-E540
Flash Memory, 3D TLC NAND, 512 GB, 512G x 8bit, eMMC 5.1, FBGA, 153 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerFLEXXON
Manufacturer Part NoFEMC512GBE-E540
Order Code4378892
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $687.820 ($790.993) |
| 5+ | $642.930 ($739.3695) |
Price for:Each
Minimum: 1
Multiple: 1
$687.82 ($790.99 inc GST)
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Product Information
ManufacturerFLEXXON
Manufacturer Part NoFEMC512GBE-E540
Order Code4378892
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
Flash Memory Type3D TLC NAND
Memory Density512GB
Memory Configuration512G x 8bit
InterfaceseMMC 5.1
IC Case / PackageFBGA
No. of Pins153Pins
Clock Frequency Max200MHz
Access Time-
Supply Voltage Min2.7V
Supply Voltage Max3.6V
Supply Voltage Nom3.3V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range3.3V eMMC NAND Flash Memories
SVHCTo Be Advised
Product Overview
FEMC512GBE-E540 is an AXO series industrial eMMC 5.1 flash memory. It is fully comply with JEDEC eMMC5.1 Standard. It is combined with an embedded flash controller and standard 3D TLC NAND flash memory in one JEDEC standard package. It provides high performance, good reliability, and advanced power management. It is suitable for small, low-power electronic devices.
- 512GB capacity, VCCQ: 1.8V/3.3V, VCC: 3.3V power system
- Compliant with eMMC specification Ver. 5.1
- High-speed eMMC protocol, clock frequency range from 0 to 200MHz
- Supports three data bus widths: 1 bit (default), 4bits, 8bits
- Supports high speed mode HS400, supports production state awareness
- Supports field firmware update
- Supply voltage (NAND) range from 2.7 to 3.6V, 1.125V/ns min slew rate (with respect to VIH/VIL)
- Clock rise time is 3ns max (CL ≤30pF), clock fall time is 3ns max (CL ≤30pF)
- Output delay time during data transfer is 13.7ns max (CL ≤30 pF)
- 153-ball FBGA package, operation temperature range from -40°C to 85°C
Technical Specifications
Flash Memory Type
3D TLC NAND
Memory Configuration
512G x 8bit
IC Case / Package
FBGA
Clock Frequency Max
200MHz
Supply Voltage Min
2.7V
Supply Voltage Nom
3.3V
Operating Temperature Min
-40°C
Product Range
3.3V eMMC NAND Flash Memories
Memory Density
512GB
Interfaces
eMMC 5.1
No. of Pins
153Pins
Access Time
-
Supply Voltage Max
3.6V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
To Be Advised
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423990
US ECCN:5A992.c
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:To Be Advised
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000001