CYW20835PB1KML1GGF
Bluetooth Module, 2.4GHz, Bluetooth LE 5.2, 2 Mbps, -94.5 dBm, 1.62 to 3.63 VDC, -30 °C to 85 °C
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $4.880 ($5.612) |
| 10+ | $3.880 ($4.462) |
| 25+ | $3.740 ($4.301) |
| 50+ | $3.640 ($4.186) |
| 100+ | $3.540 ($4.071) |
| 500+ | $2.860 ($3.289) |
Product Information
Product Overview
CYW20835PB1KML1GGF is an AIROC™ CYW20835 Bluetooth® LE system on chip. It is a Bluetooth® 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions. The AIROC™ CYW20835 Bluetooth® LE SoC is designed to support the entire spectrum of Bluetooth® Low Energy use cases for home automation, accessory, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, wireless input devices including game controllers, remote controls, keyboards, and joysticks or any Bluetooth® LE connected IoT application.
- 96-MHz Arm® Cortex®-M4 microcontroller unit MCU with floating point unit (FPU)
- Supports serial wire debug (SWD)
- Runs Bluetooth® stack and application
- 384KB RAM, 2MB ROM memory
- 1x I2S, 1x PCM, PDM, analogue front end for analogue microphone
- 24 GPIOs
- 6x 16-bit PWMs, WDT, 1x peripheral UART, 1x UART for programming and HCI, 1x SPI, 1x I2C, 1xADC
- Wide operating voltage range - 1.625V to 3.63V
- 4 power modes to implement ultra-low power application
- 7mm x 7mm 60-pin quad flat no-lead (QFN) package
Technical Specifications
Bluetooth LE 5.2
3.63VDC
2Mbps
-94.5dBm
85°C
No SVHC (21-Jan-2025)
1.62VDC
-
Class 1
-30°C
AIROC Series
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate