509-0623
Solder Wire, Lead Free, 1.2mm Diameter, 227°C, 250g, Alloy 99.3, 0.7 Sn, Cu
| Manufacturer | MULTICOMP |
|---|---|
| Manufacturer Part No | 509-0623Copy |
| Manufacturer Standard Lead Time | 12 weeks |
| Order Code | 5090623 |
| Product Range | Multicomp Type 511 Solder Wire |
| Your Part Number | |
| Technical Datasheet |
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| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $134.260 ($154.399) |
| 5+ | $121.170 ($139.3455) |
| 10+ | $112.910 ($129.8465) |
Product Information
| Manufacturer | MULTICOMP |
|---|---|
| Manufacturer Part No | 509-0623Copy |
| Manufacturer Standard Lead Time | 12 weeks |
| Order Code | 5090623 |
| Product Range | Multicomp Type 511 Solder Wire |
| Technical Datasheet | |
| Leaded / Lead Free | Lead Free |
| Flux Type | No Clean and Rosin Flux |
| Solder Alloy | 99.3, 0.7 Sn, Cu |
| External Diameter - Metric | 1.2mm |
| External Diameter - Imperial | 0.047" |
| Melting Temperature | 227°C |
| Weight - Metric | 250g |
| Weight - Imperial | 8.818oz |
| Product Range | Multicomp Type 511 Solder Wire |
| SVHC | No SVHC (14-Jun-2023) |
Product Overview
Multicomp Typ 511 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish.
- Contains multiple cores of rosin based flux
- Pale coloured residues do not require cleaning
- Extra wetting ability for faster soldering
- For all general purpose lead-free electronic assembly and re-work applications
- Complies with all lead-free legislative requirements
- Multicomp products are rated 4.6 out of 5 stars
- 12 month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
Applications
Maintenance & Repair, Industrial, Communications & Networking, Audio
Notes
Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, normal activation level
Technical Specifications
| Leaded / Lead Free | Lead Free |
|---|---|
| Solder Alloy | 99.3, 0.7 Sn, Cu |
| External Diameter - Imperial | 0.047" |
| Weight - Metric | 250g |
| Product Range | Multicomp Type 511 Solder Wire |
| Flux Type | No Clean and Rosin Flux |
|---|---|
| External Diameter - Metric | 1.2mm |
| Melting Temperature | 227°C |
| Weight - Imperial | 8.818oz |
| SVHC | No SVHC (14-Jun-2023) |
Technical Docs (2)
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Legislation and Environmental
| Country of Origin: Country in which last significant manufacturing process was carried outCountry of Origin: | Germany Country in which last significant manufacturing process was carried out |
|---|---|
| Tariff No: | 83113000 |
| US ECCN: | EAR99 |
| EU ECCN: | NLR |
| RoHS Compliant: | Not applicable |
| RoHS Phthalates Compliant: | Not applicable |
| SVHC: | No SVHC (14-Jun-2023) |
| Download Product Compliance Certificate | Product Compliance Certificate |
| Weight (kg): | .26 |