LBEE5XV2EA-802
WiFi & Bluetooth Module, Wireless Connectivity, 2.4/5/6 GHz, ADC/GPIO/HCI/I2S/PCIe/PCM/SDIO/UART
Need more?
| Quantity | Price (Incl GST) |
|---|---|
| 1+ | $55.400 ($63.710) |
| 5+ | $47.920 ($55.108) |
| 10+ | $40.420 ($46.483) |
| 50+ | $39.910 ($45.8965) |
| 100+ | $36.970 ($42.5155) |
Product Information
Product Overview
LBEE5XV2EA-802 is a Type 2EA small and very high-performance module based on Infineon CYW55573 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax 2×2 MIMO Bluetooth® 5.3 BR/EDR/LE up to 1.2Gbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Legacy Bluetooth (EDR), and 2Mbps PHY data rate on Bluetooth® LE. The WLAN section supports PCIe v3.0 Gen 2 and SDIO 3.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data. The CYW55573 implements highly sophisticated enhanced collaborative coexistence H/W mechanisms and algorithms, which ensure that WLAN and Bluetooth® collaboration is optimized for maximum performance. In IEEE 802.11ax mode, WLAN operation supports rates of MCS0–MCS11 (up to 1024 QAM) in 20MHz, 40MHz and 80MHz channels for data rate up to 1.2Gbps. The small form factor facilitates integration into size and power sensitive applications such as IoT applications, handheld wireless system, gateway and more.
- Good for industrial applications with operating temperature up to +85°C
- 2.4GHz, 5GHz & 6GHz Wi-Fi® + Bluetooth® module
- FCC/IC "Reference" certified
Technical Specifications
6GHz
Wireless Connectivity
No SVHC (21-Jan-2025)
ADC, GPIO, HCI, I2S, PCIe, PCM, SDIO, UART
-
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Switzerland
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate